International Conference on Leadership in Business and Management

Important dates

1. 19 Oct

   Abstract / full paper deadline

   Passed

2. 15 Nov

   Conference

   Columbus, Ohio, USA

All deadlines are as published by the organizer. Check the official website for the time zone.

About this conference

The idea of the conference is for the scientists, scholars, engineers and students from the Universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the Universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. This Conference is Organized by Institute for Collaborative Learning in Business and ManagementICLBM. The conference would offer a large number of invited lectures from renowned speakers all over the country. The Best paper awards will be given for the papers judged to make the most significant contribution to the conference.

Topics and scope

• Leadership in Business
• Strategic Leadership and Business Growth
• Entrepreneurial and Innovative Leadership
• Corporate Governance and Ethical Leadership
• Leadership in Startups and Emerging Markets
• Sustainable and Green Business Leadership
• Leadership in Management
• Organizational Change and Transformation
• Human Resource Leadership and Talent Development
• Decision-Making and Problem-Solving in Management
• Leadership in Operations and Project Management
• Emotional Intelligence and Managerial Effectiveness
• Leadership Development and Education
• Leadership Training and Capacity Building
• Innovative Pedagogies in Leadership Education
• Mentorship and Coaching Practices
• Measuring Leadership Impact and Performance
• Future Skills for Next-Generation Leaders

Call for papers

The call for papers closed on 19 October 2026. For other conferences, see open calls for papers in this field.